Customized Wafer Ring / Dicing Ring / Wafer Frame | Precision Solutions for Semiconductor Manufacturing

High-Precision Wafer Frames for Reliable Semiconductor Processing

In semiconductor manufacturing and advanced packaging, Wafer Rings, Dicing Rings, and Wafer Frames are essential components for wafer grinding, thinning, dicing, and back-end processing. When used with specialized dicing tape, these frames provide secure wafer support and positioning, helping minimize vibration, deformation, and misalignment during precision manufacturing processes.

UnionTech specializes in high-quality wafer frames and customized precision semiconductor components, offering standard 6-inch, 8-inch, 10-inch, and 12-inch sizes, as well as fully customized dimensions to meet various equipment specifications and process requirements.

Wide Material Selection for Different Process Requirements

UnionTech offers a comprehensive range of metal and engineering plastic materials to accommodate different manufacturing environments and applications:

• SUS420J2: High hardness and excellent wear resistance for durable, reusable wafer frames.

• SUS316: Superior corrosion resistance for demanding chemical processing environments.

• SUS301: Excellent mechanical strength and flexibility for specialized structural designs.

• SUS304: Reliable corrosion resistance, machinability, and structural stability.

• PPS: Excellent thermal resistance, chemical resistance, and dimensional stability.

• ABS: Suitable for selected lightweight and customized engineering plastic applications.

• Magnesium-Aluminum Alloys: Lightweight structural solutions with high rigidity, depending on design requirements.

Through optimized material selection and structural design, UnionTech helps customers improve wafer handling safety, equipment compatibility, and component durability.

Precision Surface Finishing Options

UnionTech provides customized surface finishing solutions to meet different semiconductor manufacturing requirements.

Surface Finish	Surface Roughness
Polished / Glossy Finish	Ra < 0.1 μm
Matte Finish	Ra 0.2–0.5 μm
Sandblasted Finish	Ra > 1.0 μm

Surface finishes can be selected based on dicing tape contact characteristics, cleanliness requirements, friction properties, and specific equipment applications.

Fully Customized Wafer Frame Design & Precision Manufacturing

Beyond standard wafer frame products, UnionTech offers comprehensive customization capabilities to support various semiconductor equipment and manufacturing processes.

Available Sizes & Configurations:

• 6", 8", 10", and 12" Wafer Frames

• Square Wafer Frames

• Round Wafer Frames

• Special-Shaped Wafer Frames

• Custom Dimensions and Equipment-Specific Designs

Precision Manufacturing Capabilities:

• CNC Precision Machining

• Precision Grinding

• Surface Polishing

• Laser Marking and Engraving

• Customized Logos, Lot Numbers, Dates, and Serial Numbers

• 2D Code Marking for Product Identification and Traceability

Our precision manufacturing capabilities enable consistent product quality, reliable positioning, and compatibility with automated semiconductor processing equipment.

Semiconductor Applications & Global Customer Experience

UnionTech Wafer Rings and Dicing Frames are suitable for a wide range of semiconductor applications, including:

• Wafer Dicing / Die Saw

• Wafer Thinning / Back Grinding

• Wafer Mounting and Dicing Tape Applications

• Semiconductor Assembly and Testing (OSAT)

• Advanced Semiconductor Packaging

• Wafer Handling and Automation Systems

UnionTech has extensive experience serving leading semiconductor companies, including TSMC, Amkor, ASE, PTI, KLA, SPIL, and Micron, demonstrating our commitment to precision manufacturing, customized engineering solutions, and semiconductor supply chain support.

Why Choose UnionTech?

UnionTech delivers more than standard Wafer Rings. We provide fully customized wafer frame solutions designed to meet the demanding requirements of semiconductor manufacturing.

By integrating material engineering, precision machining, surface finishing, and customized structural design, we help customers improve wafer holding stability, process consistency, and equipment compatibility while minimizing manufacturing risks.

Whether you require standard Wafer Frames, specialized materials, unique geometries, or high-precision custom designs, UnionTech provides professional manufacturing solutions based on your drawings, equipment specifications, and process requirements.

UnionTech — Your Trusted Partner for Customized Wafer Frames & Precision Semiconductor Components.