UnionTech
OUR SERVICES
Let UnionTech be your trusted partner for all wafer-related challenges. We're committed to delivering innovative solutions that enhance your semiconductor manufacturing success.
We are a professional R&D and technology-driven company specializing in the semiconductor industry, with team members from Taiwan, Singapore, Japan, Malaysia, and South Korea, etc. Our operations span the entire semiconductor value chain, from front-end wafer processing to back-end assembly and packaging.
With deep process knowledge across wafer fabrication, assembly, packaging, and testing, Union Technology supports customers from engineering development to stable mass production.
Our core products and services include:
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Customized Wafers
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Wafer Dicing Process Accessories
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DISCO Equipment Spare Parts and Consumables
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Semiconductor Related Precision Components
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AlSiC Heat Spreaders for SoIC packaging
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Precision spare parts, jigs, fixtures, and molds
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Customized high precision parts for Die Saw / Die Bond / Wire Bond
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Customized high precision parts for CoWoS/SoIC/FOPLP
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Wafer dicing process precision parts
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Customized Wafer frames / Wafer carriers / Wafer trays
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UV Tapes, Kapton Tapes
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Customized Vacuum Bags, Packaging Bags
We support a diverse range of customers including wafer fabs (foundries and IDMs), OSAT (Outsourced Semiconductor Assembly and Test) providers, and semiconductor equipment manufacturers.
Our production and support facilities are located in Taiwan, Malaysia, Singapore, Japan, China, and South Korea — enabling us to provide localized services, fast response times, and tailored solutions based on each customer’s specific technical and operational needs.
With strong technical expertise, regional manufacturing flexibility, and a commitment to innovation, we strive to be a reliable partner to our clients in this fast-evolving industry.
Bare Wafer
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Large-diameter silicon wafers (12-inch/18-inch): Enable sub-7nm advanced nodes.
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Compound semiconductor wafers: SiC/GaN for EVs, 5G, and high-growth markets.
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Specialty substrates: SOI wafers (low-power), patterned wafers (lithography verification).
Blanket Wafer
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Oxide Blanket Wafer (SiO₂)
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Metal-coated Blanket Wafer
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Epitaxial Blanket Wafer
Pattern Wafer
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Line width accuracy: Within ±5nm
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Overlay accuracy: <3nm
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Defect density: <0.1/cm²
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Materials: Silicon, compound semiconductors, etc.
Semiconductor Precision Components
Semiconductor Molds and Parts
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Customized high precision parts for Die Saw / Die Bond / Wire Bond/Trim&Form
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Customized high precision parts for CoWoS/SoIC/FOPLP
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Wafer dicing process precision parts
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Customized Wafer frames
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Jig design
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Ceramic parts design
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Customized Copper Machining
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Non-traditional metal material thermal balance advantages
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High thermal conductivity
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Low thermal expansion coefficient (CTE close to silicon)
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Excellent warpage control ability
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Good process compatibility
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Enhanced packaging reliability
Precision Fixture Design and Manufacturing
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Ceramic, quartz mold processing design
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Professional polishing treatment and surface optimization
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Customized development of various process-specific fixtures
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Automatic dross removal, burr removal, pin bending, mold processing
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Semiconductor encapsulation molds, part design and manufacturing
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Precision parts, tungsten carbide punch processing
AlSiC Heat Sinks
Die Bond/Wire Bond Core Components
Wafer Dicing Frame &Carriers
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High-precision Bonding Head
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Ejector & Alignment Components
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Stage & high-wear cutting process components
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Wafer Frame/Ring
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Wafer Frame Carrier
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Frame Cassette
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Frame Storage Box
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Wafer Box
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Expander Ring
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Wafer Cassette
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Wafer Basket
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Customized Magazines
Customized Fixtures and Precision Parts
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Providing one-stop solutions from drawings to physical products for customers' specific process needs.
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Wire Bond fixtures and various stage components, featuring excellent dimensional stability and durability.
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Precision parts processing, meeting the stringent tolerance requirements of semiconductor backend packaging processes.
Diverse Material Processing Capabilities
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Ceramic
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Quartz
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Tungsten
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Speical Alloys
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Copper
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Other special material
Metal and Electronic Parts Processing
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Professional CNC milling precision processing
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Design and manufacturing of electronic components and mechanical parts
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Handling of difficult materials and complex geometric structures