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OUR SERVICES

Let UnionTech be your trusted partner for all wafer-related challenges. We're committed to delivering innovative solutions that enhance your semiconductor manufacturing success.


We are a professional R&D and technology-driven company specializing in the semiconductor industry, with team members from Taiwan, Singapore, Japan, Malaysia, and South Korea, etc. Our operations span the entire semiconductor value chain, from front-end wafer processing to back-end assembly and packaging.

Our core products and services include:

  • Customized Wafers

  • Wafer Dicing Process Accessories

  • Photolithography Systems Equipment

  • DISCO Equipment Spare Parts and Consumables

  • Advanced Packaging Materials

  • Semiconductor Related Precision Components

  • UV Tapes, Kapton Tapes

  • Customized Vacuum Bags, Packaging Bags


We support a diverse range of customers including wafer fabs (foundries and IDMs), OSAT (Outsourced Semiconductor Assembly and Test) providers, and semiconductor equipment manufacturers.

Our production and support facilities are located in Taiwan, Malaysia, Singapore, Japan, China, and South Korea — enabling us to provide localized services, fast response times, and tailored solutions based on each customer’s specific technical and operational needs.

With strong technical expertise, regional manufacturing flexibility, and a commitment to innovation, we strive to be a reliable partner to our clients in this fast-evolving industry.

Bare Wafer

  • Large-diameter silicon wafers (12-inch/18-inch): Enable sub-7nm advanced nodes.

  • Compound semiconductor wafers: SiC/GaN for EVs, 5G, and high-growth markets.

  • Specialty substrates: SOI wafers (low-power), patterned wafers (lithography verification).

Blanket Wafer

  • Oxide Blanket Wafer (SiO₂)

  • Metal-coated Blanket Wafer

  • Epitaxial Blanket Wafer

Pattern Wafer

  • Line width accuracy: Within ±5nm

  • Overlay accuracy: <3nm

  • Defect density: <0.1/cm²

  • Materials: Silicon, compound semiconductors, etc.

Semiconductor Precision Components

  • Bearings

  • Mold component design

  • Jig design

  • Ceramic design

  • Special-shaped component design

  • Vacuum component series

  • Sputtering target & Bonding service

Stainless Steel Plate for Semiconductor

  • Material: SUS420J2 (JIS)

  • Thickness: 1.2mm ±0.02mm / 1.5mm ±0.03mm

  • Hardness: 50-55 HRC (Through-hardened)

  • Flatness: ≤0.2mm (Meeting SEMI Standards)

  • Surface Finish: Precision Grinding (Ra ≤0.4μm)

  • Corner Tolerance: ±0.05mm right-angle precision

@Union Technology Co., Ltd.

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Partnership Without Boundaries,
Service Without Limits

UnionTech is a leading global supplier of advanced wafer solutions and semiconductor process technologies. With decades of expertise in the semiconductor industry, we provide comprehensive support across the entire wafer lifecycle - from material selection to final device production.

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Why Choose UnionTech?

• Industry-Leading Quality: Our wafers meet SEMI standards and exceed industry requirements

• Technical Excellence: Staffed by PhD-level materials scientists and process engineers

• Rapid Response: 24/7 technical support with average 4-hour response time

• Global Network: Serving customers in 10+ countries with local support centers

 

Our technical team will:

  1. Conduct a thorough needs assessment

  2. Provide multiple solution options

  3. Offer detailed technical specifications

  4. Follow up with implementation support

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