AlSiC Heat Spreader Solution for SoIC Packaging

Solving Thermal & Reliability Challenges in Advanced Packaging

by Union Technology

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1. Customer Pain Points｜客戶在 SoIC 封裝中面臨的痛點

As SoIC (System on Integrated Chips) packaging moves toward higher power density and tighter integration, customers frequently encounter:

 • Excessive heat concentration impacting device performance

 • Thermal stress and warpage caused by material CTE mismatch

 • Reliability risks during thermal cycling and long-term operation

 • Limited material options balancing thermal performance, mechanical stability, and cost

For many SoIC applications, achieving thermal control, package integrity, and cost efficiency simultaneously is a major challenge.

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2. Our Solution｜Union Technology 的解決方案

Union Technology offers customized AlSiC (Aluminum Silicon Carbide) heat spreaders designed specifically for SoIC packaging applications.

AlSiC combines the advantages of metal and ceramic materials, providing a balanced thermal, mechanical, and cost-effective solution for advanced packaging needs.

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3. Key Advantages of AlSiC Heat Spreaders｜AlSiC 的核心優勢

How AlSiC Solves Customer Challenges:

 • CTE matching to silicon

→ Reduces thermal stress, warpage, and interface delamination

 • Good thermal conductivity

→ Effectively spreads heat in high-power SoIC structures

 • High stiffness and mechanical strength

→ Supports stacked die architectures and package integrity

 • Cost-effective compared to full ceramic solutions

→ Optimized balance between performance and total cost of ownership

AlSiC is particularly suitable for medium-to-high power SoIC applications requiring both reliability and cost control.

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4. Customization & Manufacturing Support｜客制化與製造支持

Each AlSiC heat spreader is custom-designed based on:

 • SoIC package structure and power distribution

 • Assembly processes and interface materials

 • Reliability and lifecycle requirements

Union Technology supports customers from design validation and prototyping to volume manufacturing, ensuring smooth integration into existing production flows.

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5. Customer Benefits｜為客戶帶來的效益

 • Improved thermal management and temperature stability

 • Reduced package warpage and thermo-mechanical stress

 • Enhanced long-term reliability and product lifetime

 • Optimized cost-performance balance for mass production

 • Simplified supplier management through integrated solutions

Union Technology helps customers solve thermal challenges without over-designing or over-costing their SoIC packages.

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Union Technology

Global Manufacturing Solutions for Advanced Semiconductor Packaging